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Description
Yokogawa F3SP71-4S FA-M3 Sequence CPU Module
The Yokogawa F3SP71-4S, also cataloged as the F3SP71-4S Sequence CPU Module, operates as a dedicated hardware component for executing ladder logic and application instructions within the FA-M3 multi-controller network.
Hardware Specifications
Parameter
Specification
ModelBrand
F3SP71-4S
Origin
Japan
Weight
140 g
Dimensions
28.9 mm (W) x 100 mm (H) x 83.2 mm (D)
OperatingTemp
0 to 55 degC
PowerConsumption
460 mA @ 5 V DC internal supply
ProgramCapacity
Approx. 60K steps
InstructionExecution
Basic: 0.0175 µs, Application: 0.035 µs
DataRegisters
D: 65,536 words, W: 8,192 words, R: Up to 262,144 words
MaxIOPoints
8,192 points (remote I/O), 1,920 points (local)
CommunicationPorts
USB2.0 (12 Mbps), Ethernet
Process Control Connectivity
The module integrates with 4-20 mA HART loops and supports FOUNDATION Fieldbus/Profibus PA connectivity. Channel-to-channel isolation is implemented to prevent signal interference between adjacent I/O modules. Cold junction compensation (CJC) is available for accurate temperature measurement in analog input channels.
Frequently Asked Questions
Q: Does the F3SP71-4S support hot-swapping of modules? A: Hot-swap is not supported; the module must be powered down before insertion or removal.
Q: What is the maximum backplane current load for the CPU module? A: The module draws approximately 460 mA from the 5 V DC internal power supply; ensure the backplane can sustain this load for all connected modules.
Q: Is firmware upgrade backward compatible? A: Firmware updates must match the FA-M3 series revision; backward compatibility with older revisions is limited.
Field Installation Guidelines
Install the CPU module in a dry, ventilated enclosure to maintain the operating temperature between 0 and 55 degC. Ensure that all backplane connections are fully seated and that Ethernet/USB interfaces are shielded and grounded. Avoid routing power and signal cables in parallel to minimize electromagnetic interference. Observe manufacturer torque specifications for mounting screws and ensure memory card insertion follows proper orientation. Maintain at least 10 mm spacing between adjacent modules for natural air cooling.
