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Description
Yokogawa DP97-B Display Processor Card
The Yokogawa DP97-B, also cataloged as the DP97-B Display Processor Card, operates as a dedicated hardware component for real-time measurement data processing within operator station networks. It executes continuous analog and digital signal handling for monitoring thickness and coat weight profiles.
Suffix Breakdown & Model Matrix
This model is fixed as DP97-B. No further suffix decomposition is defined or documented. The module functions as a standalone display processor card for system integration via standard backplane edge connectors.
Hardware Specifications
Parameter
Specification
ModelBrand
Yokogawa DP97-B
Origin
Japan
Weight
0.5 kg
Dimensions
96 mm (H) x 96 mm (W) x 100 mm (D)
OperatingTemp
0 degC to 50 degC
StorageTemp
-20 degC to 70 degC
Humidity
20% to 90% RH (non-condensing)
PowerConsumption
100-240 VAC, 50/60 Hz
Accuracy
±0.1% of span for measurement/control
RedundancySupport
Backup configurations supported
Interface
4 x coaxial connectors (KB / R / G / B)
Process Control Features
The DP97-B implements channel-to-channel isolation to mitigate cross-interference within 4-20 mA HART loops and supports cold junction compensation (CJc) for thermocouple signal accuracy. It integrates directly with FOUNDATION Fieldbus and Profibus PA networks, ensuring electrical signal separation between analog input channels and display output circuits.
Frequently Asked Questions
Q: Does the DP97-B support hot-swap replacement in live systems? A: The module is not designed for hot-swap operation; power must be removed prior to insertion or removal to avoid signal disruption.
Q: What is the typical backplane load for the DP97-B? A: The board draws power from the system backplane or designated power rail; nominal load does not exceed standard edge connector limits for 96 mm x 96 mm cards.
Q: Can firmware be updated on the DP97-B? A: Firmware updates are possible only via the host operator station interface; the card does not support independent flash operations.
Field Installation Guidelines
Ensure module orientation matches system backplane markings to prevent misalignment of pin-type edge connectors.
Connect coaxial lines (KB / R / G / B) using shielded cables with grounded shields to minimize electromagnetic interference.
Avoid routing analog and digital cabling in parallel over distances exceeding 2 meters without separation or additional shielding.
Verify ambient enclosure temperature remains within 0-50 degC and relative humidity stays below 90% RH.
Maintain a minimum 5 mm spacing from adjacent modules to allow airflow for thermal dissipation.
Confirm power supply polarity and voltage levels before initial energization; the board does not include reverse-voltage protection.