Schneider Electric TSXSUP702 Modicon Power Supply Module The Schneider Electric TSXSUP702, also cataloged as the TSXSUP702 Power Supply Module, operates...
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Description
Schneider Electric TSXSUP702 Modicon Power Supply Module
The Schneider Electric TSXSUP702, also cataloged as the TSXSUP702 Power Supply Module, operates as a dedicated hardware component for providing stable AC-to-DC power conversion within Modicon PLC platforms.
Suffix Breakdown & Model Matrix
This model is a fixed single configuration unit. No suffix variations or sub-model matrix exist for the TSXSUP702.
Hardware Specifications
Parameter
Specification
ModelBrand
Schneider Electric
Origin
France
Weight
1.81 kg (4.00 lbs)
Dimensions
Standard Modicon rack module form factor
OperatingTemp
0 to 60 degC
OperatingHumidity
80% RH non-condensing
StorageHumidity
80% RH non-condensing
MaximumOperatingAltitude
1000 m without derating
InputVoltage
220 to 240 V AC
OutputPower
65 W
VoltageType
AC
Industrial Control Technical Features
The TSXSUP702 integrates with Modicon backplane bus systems, supporting deterministic communication across Profinet and EtherNet/IP networks. Firmware flash compatibility ensures in-field updates without bus interruptions. Odensity scaling is applied to maintain power stability under variable input conditions, optimizing module-to-module voltage distribution in multi-rack setups.
Frequently Asked Questions
Q: VnA: Can the TSXSUP702 be hot-swapped without shutting down the PLC? A: The module supports insertion and removal under powered conditions if the backplane bus current load is within specified limits. Standard ESD precautions must be followed.
Q: VnA: How does the TSXSUP702 manage overvoltage or transient spikes? A: The unit incorporates internal surge suppression circuits to protect the DC output from brief AC voltage surges. External line protection is recommended for high-risk installations.
Q: VnA: Is firmware flash required for standard operation? A: Firmware updates are optional and relate solely to compatibility improvements. Standard operation is maintained with factory firmware.
Field Installation Guidelines
Mount the module vertically in a standard Modicon rack to ensure proper airflow.
Maintain a minimum 20 mm clearance around the module for heat dissipation.
Connect AC input lines using appropriately rated conductors with tight torque to terminals.
Ensure the backplane bus connectors are fully engaged to avoid intermittent contact.
Follow proper grounding and shielding practices to minimize electrical noise and maintain deterministic bus performance.
Avoid routing high-current power cables parallel to communication bus lines to prevent interference.