Schneider Electric TSXP57453AM Modicon Premium Automation Platform The Schneider Electric TSXP57453AM, also cataloged as the TSXP57453AM Double-format PL7 processor, operates...
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Description
Schneider Electric TSXP57453AM Modicon Premium Automation Platform
The Schneider Electric TSXP57453AM, also cataloged as the TSXP57453AM Double-format PL7 processor, operates as a dedicated hardware component for industrial process execution and logic control within Modicon Premium Automation platform networks.
Hardware Specifications
Parameter
Specification
Model
TSXP57453AM
Brand
Schneider Electric
Origin
France
Weight
0.56 kg
Dimensions
Double-format slot configuration
OperatingTemp
0...60 degC
PowerConsumption
1080 mA backplane current load
Software Designation
PL7 Junior/Pro
Rack Capacity
8 racks with 12 slots, 16 racks with 4/6/8 slots
Maximum Number of Slots
Limit of 128 slots
Discrete I/O Capacity
2040 I/O channels
Analogue I/O Capacity
256 I/O channels
Application Specific Channels
Up to 64 channels
Process Control Channels
Up to 20 channels (maximum 60 simple loops)
Integrated Connection Type
2 female mini DIN non-isolated serial links (19.2/115 kbit/s), 1 SUB-D 9 Fipio manager (127 agents)
Communication Module Limits
8 AS-Interface bus modules, 4 network modules, 2 fieldbus modules (1 if CANopen used), 1 CANopen bus module
Internal RAM Configuration
96 Kwords program and data (without PCMCIA), 176 Kwords data (with PCMCIA)
PCMCIA Memory Expansion
992 Kwords program card, 2048 Kwords additional data storage card
Backplane Bus Communication and I/O Density Scaling
The architecture of this processor leverages a synchronized backplane bus structure capable of managing deterministic logic distribution across multiple racks. The system coordinates high-density discrete and analogue scaling through dedicated application-specific channels without degrading cyclical execution periods. Internal data exchanges are optimized via internal RAM allocations, preventing bottlenecks during multi-axis or complex loop control routines.
Frequently Asked Questions
Q: What is the maximum backplane current draw for the TSXP57453AM processor?
A: The processor draws a steady-state current of 1080 mA from the backplane power supply module. System power budget calculations must account for this fixed consumption prior to adding peripheral I/O modules.
Q: Can the processor run application tasks without a PCMCIA card installed?
A: Yes. The internal RAM provides 96 Kwords for basic program and data structures. However, utilizing the full processing capability requires the installation of specific PCMCIA memory expansion cards for program execution up to 992 Kwords and data storage up to 2048 Kwords.
Field Installation Guidelines
Enclosure and Environment: Mount the rack assembly horizontally inside an IP54 or higher industrial enclosure to maintain compliance with Pollution Degree 2 requirements and protect against airborne contaminants.
Grounding Requirements: Establish a low-impedance connection between the chassis grounding terminal and the central functional earth grid. Ensure all rack securing screws are torqued properly to maintain ground continuity across the backplane.
Thermal Management: Maintain a clearance minimum of 50 mm above and below the rack modules to facilitate natural convection. Do not exceed the maximum operating temperature threshold of 60 degC.