Description
Description
The 170INT11003 is a specialized communication adapter module designed for the Schneider Electric Modicon Premium automation platform. This unit serves as an Interbus interface, facilitating seamless data exchange and network connectivity within industrial control architectures. Please note that this component has been discontinued by the manufacturer, making it a critical spare part for maintaining legacy control systems.
Features
- Designed for integration with Modicon Premium series processors.
- Provides dedicated Interbus communication protocol support.
- Features SUPI3 technology for reliable fieldbus data management.
- Compact hardware footprint suitable for standard rack-mount installations.
Technical Specifications
| Manufacturer |
Schneider Electric |
| Model Number |
170INT11003 |
| Module Type |
Interbus Communication Adapter |
| Technology |
SUPI3 |
| Status |
Discontinued |
Installation Guidelines
- Ensure the PLC rack power is fully disconnected before attempting to insert or remove the communication module.
- Verify that the module is correctly seated in the designated slot to ensure proper backplane connectivity.
- Handle the module by the edges to prevent electrostatic discharge (ESD) damage to the internal circuitry.
- Confirm that the Interbus cabling is shielded and routed away from high-voltage power lines to minimize electromagnetic interference (EMI).
- Check for proper ventilation around the rack to maintain operating temperatures within specified industrial limits.
FAQ
Is this module compatible with all Modicon Premium CPUs?
The 170INT11003 is specific to Interbus network configurations within the Modicon Premium range. Compatibility depends on your specific rack configuration and firmware version. Consult your original system documentation to verify slot requirements.
What does the SUPI3 designation indicate?
SUPI3 refers to the specific Siemens Universal Protocol Interface technology integrated into this module to manage the Interbus fieldbus communication tasks.
