Schneider Electric BMXXBP1200 Modicon M340 Rack Backplane Configured for deterministic backplane bus interconnection in Modicon M340 automation architectures, the Schneider...
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Description
Schneider Electric BMXXBP1200 Modicon M340 Rack Backplane
Configured for deterministic backplane bus interconnection in Modicon M340 automation architectures, the Schneider Electric BMXXBP1200 (BMXXBP1200 Rack) provides direct physical and electrical distribution across a 12-slot X Bus structure. It enables module-level communication routing between CPU, I/O, and power supply assemblies through a passive backplane topology with defined slot indexing and fixed mechanical alignment.
Suffix Breakdown & Model Matrix
BMXXBP1200:
BMX: Modicon M340 platform prefix
XB P: X Bus backplane rack architecture
1200: 12-slot configuration identifier
Hardware Specifications
Parameter
Specification
ModelBrand
Schneider Electric BMXXBP1200
Origin
France
Weight
1.27 kg
Dimensions
103.7 mm (H) x 503.2 mm (W) x 19 mm (D)
OperatingTemp
0 degC to 60 degC
PowerConsumption
0.74 W
Slot Capacity
12-slot X Bus backplane
Electrical Interface
XBE expansion connector
Mounting Method
4 x M6 screws or panel mounting (4 x 4.32...6.35 mm screws)
Protection Class
IP20
PLC Backplane Bus Communication Characteristics
The Schneider Electric Modicon M340 backplane architecture implements deterministic internal bus arbitration between CPU (BMXP34), power supply (BMXCPS), and distributed I/O modules. Slot-to-slot signaling is synchronized through fixed impedance backplane traces, supporting firmware-level module recognition and hot configuration alignment during system initialization.
Backplane electrical loading is managed through passive distribution, where current demand is primarily governed by installed module aggregation rather than rack electronics. This structure supports stable module addressing and predictable scan-cycle synchronization within PLC task execution frameworks.
Frequently Asked Questions
Q: Does BMXXBP1200 support hot-swap of I/O modules? A: Hot insertion is not supported for all module types. Backplane power should be removed prior to module replacement to avoid bus instability.
Q: How is backplane current distributed across slots? A: Current is passively distributed via the rack bus structure; total consumption depends on installed BMXCPS power supply capacity and module load.
Q: Is BMXXBP1200 compatible with all Modicon M340 processors? A: It is designed for BMXP34 processor integration within the Modicon M340 platform only.
Field Installation Guidelines
The rack shall be mechanically secured using four-point M6 screw fixation or equivalent panel mounting hardware within the defined 4.32...6.35 mm fastening interface range. Installation requires maintaining IP20 enclosure compliance by ensuring absence of conductive debris within slot channels and backplane connectors.
Backplane alignment must be verified prior to tightening to prevent connector skew stress on X Bus interfaces. Shield continuity is maintained through rack chassis grounding; a dedicated protective earth connection is recommended at the cabinet grounding bar. Cable routing should avoid direct mechanical load on BMXCPS and BMXP34 modules installed in adjacent slots.