ICS Triplex T7310 I/O Transceiver Module Configured for triplicated I/O Safetybus communication in the ICS Triplex Trusted TMR system, the...
Read more
Available on working days between 9:00 am to 6:00 pm
Email us: sales2@industriaxplc.com
Available 24/7 for inquiries and support
Description
ICS Triplex T7310 I/O Transceiver Module
Configured for triplicated I/O Safetybus communication in the ICS Triplex Trusted TMR system, the ICS Triplex T7310 (T7310 I/O Transceiver Module) provides the physical communication path between one processor channel and its assigned I/O chassis. It receives processor commands, validates the chassis identification, transfers commands through the Safetybus backplane, buffers I/O responses, and returns data to the corresponding processor.
Hardware Specifications
Parameter
Specification
Model
T7310
Brand
ICS Triplex
Product Type
I/O Transceiver Module
System
Trusted TMR Safety System
Communication Function
I/O Safetybus communication
Redundancy Configuration
Three T7310 modules per I/O chassis
Processor Interface
One processor channel per T7310
Chassis Address Validation
Physical chassis identification switch comparison
Backplane Interface
Safetybus backplane
External Interface
I/O Safetybus cable
Origin
USA
Weight
1.15 kg
Dimensions
Estimated shipping size: 3.2 x 26.3 x 32.6 cm
Heat Dissipation
8 W, 27 BTU/hour
Operating Temperature
0 deg C to 60 deg C
Storage Temperature
-40 deg C to 85 deg C
Operating Humidity
0 to 95% RH, non-condensing
Vibration
10 to 55 Hz, +/- 0.15 mm
Tariff Code
8537101190
TMR Safetybus Communication Architecture
The T7310 operates as one channel of a three-module I/O transceiver set. Each module communicates with only one processor module, which maintains independent communication paths across the TMR architecture.
The module reads the I/O chassis identification code from incoming Safetybus commands. It then compares the received address with the physical chassis identification switch setting. Therefore, only commands addressed to the local chassis proceed through the backplane Safetybus to the designated I/O modules.
For return communication, the T7310 buffers response data from the I/O modules. It then transfers the data through the chassis backplane and I/O Safetybus cable to the associated processor channel. This arrangement maintains channel separation within the TMR communication structure.
TMR and Fail-Safe Communication Behavior
The Trusted architecture uses triple modular redundancy to maintain independent processor-to-I/O communication channels. The T7310 participates in this architecture by assigning each transceiver to a single processor channel rather than combining the three communication paths.
The available data confirms TMR operation and independent communication paths. However, the supplied specifications do not define a specific SIL certification level, galvanic isolation rating, or numerical communication latency for the T7310. These values should therefore be verified against the applicable ICS Triplex Trusted system manual before system qualification.
Frequently Asked Questions (FAQ)
Q: How many T7310 modules are installed in one I/O chassis? A: The supplied technical description specifies three T7310 modules operating as a triplicated redundant set.
Q: Does each T7310 communicate with all three processor modules? A: No. Each T7310 communicates exclusively with one processor module and maintains its corresponding communication path.
Q: How does the T7310 prevent commands from reaching the wrong I/O chassis? A: The module compares the chassis identification code in incoming commands with the physical chassis identification switch setting before directing valid commands onto the backplane Safetybus.
Field Installation Guidelines
Install the T7310 in the designated Trusted I/O chassis position and follow the chassis manufacturer's mechanical installation procedure.
Connect the I/O Safetybus cabling according to the system wiring documentation. Keep Safetybus communication cables separated from high-voltage power conductors and high-current switching circuits to reduce electrical interference.
Verify the physical chassis identification switch before commissioning. The configured identification must correspond with the chassis address expected by the processor communication system.
Ensure that the module remains within the specified 0 deg C to 60 deg C operating temperature range and 0 to 95% RH non-condensing humidity range. Maintain adequate chassis ventilation because the module dissipates approximately 8 W during operation.
Before energization, inspect the backplane connector and cable interfaces for contamination, mechanical damage, or incorrect seating. For TMR installations, verify the three independent T7310 channel positions and their associated processor and Safetybus connections against the approved system configuration.