Description
Product Description
The 51107403-100 is a dedicated I/O Address and Local Control Network communication board developed by Honeywell for use within TDC 3000 modular control architectures. This board functions as a core interface between distributed I/O modules and the system LCN, providing deterministic data exchange and accurate node addressing in large-scale control environments.
Designed for continuous industrial operation, the board integrates an RS-485 physical layer optimized for noise immunity and long-distance communication. Its low power draw and wide environmental tolerance make it suitable for installation in densely populated control cabinets and remote process units. The hardware layout emphasizes signal integrity and long-term stability, supporting mission-critical automation systems where predictable communication behavior is required.
Technical Specifications
| Parameter |
Specification |
| Model |
51107403-100 |
| Board Function |
I/O Addressing and LCN Communication Interface |
| Supply Voltage |
10 to 30 VDC |
| Nominal Power Consumption |
< 1.5 W |
| Communication Standard |
RS-485 (multi-drop capable) |
| Supported Data Rate |
4.8 kbps (LCN compatible) |
| Electrical Isolation |
Designed for industrial ground-noise environments |
| Operating Temperature |
−40 °C to +70 °C |
| Storage Temperature |
−55 °C to +85 °C |
| Relative Humidity |
Up to 95%, non-condensing |
| Form Factor |
Plug-in PCB module |
| Dimensions |
105 × 55 × 15 mm |
| Net Weight |
0.35 lbs |
Functional Characteristics
The 51107403-100 board ensures deterministic I/O addressing across multiple connected modules, reducing configuration ambiguity during system expansion or maintenance. Its RS-485 interface is tuned for stable operation in electrically noisy environments, helping preserve data integrity over extended cable runs. The compact PCB design allows deployment in space-constrained chassis without compromising thermal performance.
Typical Applications
This module is commonly deployed in process control systems where TDC 3000 platforms manage distributed field I/O. Typical use cases include chemical processing units, power generation facilities, refinery control rooms, and large manufacturing plants requiring centralized monitoring with remote I/O distribution.
FAQ
Is the 51107403-100 backward compatible with existing TDC 3000 installations?
Yes. The board is designed to integrate seamlessly with existing TDC 3000 LCN architectures without requiring firmware or wiring changes.
Does this module support higher LCN data rates?
No. The communication speed is fixed at 4.8 kbps to maintain full compatibility and timing integrity within the TDC 3000 LCN protocol.
Can it operate in high-humidity environments?
Yes. The board supports up to 95% relative humidity, provided condensation is avoided.
