Description
Product Overview
The GE IS200CABPG1BAA Control Assembly Backplane Board is a multi-layer wiring interface designed for Mark VI Innovation Series drives. It provides structured interconnections for control and power boards, adapting to various drive configurations and power levels.
This board supports modules such as IS200BAIA, IS215GBIA, IS215PBIA, IS200ACL, IS200DSPX, IS200RAPA, IS200BIC, IS200BPI, and IS200FOSA. It includes connectors for user I/O, ISBus ports, diagnostic tools, and power inputs. The board mounts directly to the rack and connects to the IS200HFPA power supply using shielded cables with 1000 Vdc isolation.
Technical Specifications
Specification |
Details |
Manufacturer |
GE |
Part Number |
IS200CABPG1BAA |
Ordering Code |
IS200CABPG1B |
Product Series |
Mark VI |
Description |
Control Assembly Backplane Board |
Voltage |
17 Vac |
Dimensions |
18 cm × 18 cm × 3 cm |
Weight |
0.5 kg |
Functional Acronym |
CABP |
Power Supply Interface |
IS200HFPA |
Isolation Rating |
1000 Vdc |
Grounding Connectors |
2 for CCOM, 2 for GND |
External Interfaces |
I/O, meters, keypad, ISBus ports |
Key Features
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Supports multiple control and power boards for flexible drive configurations
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Interfaces with external signals including I/O, meters, and diagnostic tools
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Connects to IS200HFPA via shielded and isolated power cables
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Provides stab-on connectors for CCOM and chassis ground integration
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Ties cable shields directly to chassis for improved EMI protection
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Compact 18×18×3 cm form factor fits standard rack systems
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Lightweight 0.5 kg board simplifies installation and maintenance
Applications & Compatibility
The IS200CABPG1BAA board is ideal for turbine control systems requiring centralized signal routing and power distribution. It supports Mark VI drive platforms and integrates seamlessly with a wide range of GE modules.
Compatible with:
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IS200BAIA, IS215GBIA, IS215PBIA, IS200ACL, IS200DSPX
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IS200RAPA, IS200BIC, IS200BPI, IS200FOSA
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Control cabinets using ISBus communication and 17 Vac power
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Industrial systems needing high-voltage isolation and modular expansion