Description
Product Description
The GE IC695CHS007 is a 7-slot rack/baseplate engineered for PACSystems RX3i PLCs. It provides the structural and electrical framework for installing CPUs, power supplies, and I/O modules, ensuring reliable backplane communication and stable power distribution across the system. The rack supports a high-speed RX3i backplane bus and is compatible with both RX3i and Series 90-30 I/O modules, offering a versatile solution for mid-sized control systems. Designed for industrial use, it delivers durability, compactness, and ease of integration into cabinets or enclosures.
Key Features
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Seven-slot configuration: dedicated slots for power supply and CPU, plus up to six I/O or option modules.
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High-speed RX3i backplane bus enables efficient communication and data transfer between modules.
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Supports RX3i CPUs, power supplies, discrete/analog I/O, and communication modules.
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Compact design for mid-sized control panels while maintaining accessibility.
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Industrial-grade construction for continuous operation in harsh environments.
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Horizontal orientation with internal grounding bar and included grounding terminal.
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Supports module hot-swap for uninterrupted maintenance.
Technical Specifications
| Parameter |
Specification |
| Manufacturer |
GE Fanuc / Emerson |
| Part Number |
IC695CHS007 |
| Product Type |
7-Slot Rack/Baseplate Module |
| Slots |
7 (Slot 0: power supply, Slot 1: CPU, Slots 2–6: I/O/option) |
| Supported Modules |
RX3i CPUs, power supplies, discrete/analog I/O, Series 90-30 option modules |
| Backplane Type |
High-speed RX3i bus |
| Mounting Style |
Rack/baseplate mounting, horizontal orientation |
| Dimensions |
12 × 7 × 2 in (305 × 178 × 51 mm) |
| Weight |
1.2 kg |
| Operating Temperature |
0–60 °C |
| Storage Temperature |
-40–85 °C |
| Humidity Range |
5–95% RH, non-condensing |
| Enclosure Compatibility |
NEMA/UL Type 1 (IP20) |
| Wire Size Recommended |
14–22 AWG |
| Terminal Input |
TB1: Isolated +24VDC, Terminal 8: Isolated ground |
| Backplane Orientation |
Horizontal |
| Module Hot-Swap Support |
Yes |
| Internal Power Requirements |
600 mA @ 3.3 VDC, 240 mA @ 5 VDC |
| Maximum Clearance for Installation |
102 mm (4 in.) on all sides |
Applications
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Hosting and interconnecting RX3i CPUs, power supplies, and I/O modules in mid-sized automation systems.
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Process control, energy management, and transportation system control panels.
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Integration with Series 90-30 option and I/O modules for legacy system upgrades.
FAQ
Q: How many I/O modules can the IC695CHS007 support?
A: Up to six I/O or option modules in addition to the CPU and power supply.
Q: Is it compatible with Series 90-30 modules?
A: Yes, it supports RX3i modules and Series 90-30 I/O and option modules.
Q: Can this rack/baseplate handle hot-swappable modules?
A: Yes, module hot-swap is fully supported.
Q: What is the recommended wire gauge for installation?
A: 14–22 AWG solid or stranded wires are recommended for backplane terminal connections.
