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GE IC200CHS025 I/O Carrier Module

GE IC200CHS025 I/O Carrier Module

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Overview The IC200CHS025 is a compact VersaMax carrier unit engineered by GE Fanuc Emerson for direct mounting of a single I/O module... Read more

SKU: IC200CHS025
Country of origin: USA

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    Description

    Overview

    The IC200CHS025 is a compact VersaMax carrier unit engineered by GE Fanuc Emerson for direct mounting of a single I/O module within a distributed control rack. It integrates field wiring termination, backplane interface routing, and mechanical module retention into a single vertical-format carrier.

    Designed for space-constrained control panels, this model uses spring-clamp terminal technology to simplify wiring installation while maintaining reliable electrical contact and vibration resistance.

    Mechanical Structure and Installation

    This carrier is optimized for high-density cabinet layouts and supports both DIN rail and panel mounting configurations.

    • DIN rail mounting: 35 mm standard (EN 50022)

    • Optional direct panel mounting for high-vibration environments

    • Vertical module orientation for compact rack arrangement

    • Integrated keying system to prevent incorrect module placement

    • Secure latch mechanism for stable module retention

    • Carrier-to-carrier interconnect support for backplane continuity

    Wiring Interface Design

    The IC200CHS025 uses spring-loaded IEC terminal technology to reduce installation time and eliminate the need for specialized tools.

    • 36 spring-clamp terminals total

    • Supports up to 32 signal I/O connections

    • Includes 4 dedicated common/power terminals

    • Compatible with single or dual conductor wiring

    • Wire compatibility:

      • Single wire: AWG 14–22

      • Dual wire: AWG 18

    This design improves wiring density while reducing maintenance errors in field installations.

    Electrical Ratings

    • Maximum operating voltage: 264 VAC

    • Transient voltage withstand: up to 300 VAC

    • I/O capacity: up to 32 points per carrier (module dependent)

    • Power distribution: supplied through mounted VersaMax I/O module

    • Designed for low-resistance signal continuity across backplane interface

    System Integration

    The carrier functions as a structural and electrical interface for VersaMax I/O modules, ensuring stable communication with the system backplane while maintaining correct module alignment and grounding continuity.

    It is compatible with a wide range of VersaMax digital and analog I/O modules used in modular control architectures.

    Environmental Specifications

    • Operating temperature range: -40°C to +60°C

    • Vertical spacing requirement: 2 inches

    • Horizontal spacing requirement: 1 inch

    • DIN rail grounding required for EMC compliance

    • Conductive, corrosion-resistant rail surface recommended

    Physical Characteristics

    • Length: 163.5 mm

    • Width: 66.8 mm

    • Depth: 70 mm

    • Weight: 0.68 lbs

    Applications

    • Compact PLC I/O expansion systems

    • High-density control cabinet wiring layouts

    • Machine-level modular automation systems

    • Retrofit installation of VersaMax I/O platforms

    • Vibration-sensitive industrial control panels

    FAQ

    Q1: What type of wiring system does this carrier use?
    It uses 36 spring-loaded IEC terminals for tool-free wire insertion.

    Q2: Can it be installed without DIN rail mounting?
    Yes, it supports optional panel mounting for environments with higher vibration.

    Q3: How many I/O points does it support?
    It supports up to 32 I/O channels plus 4 common/power connections depending on module configuration.

    Specifications

    • Brand: General Electric

    Advantages

    • High reliability in industrial environments
    • Supports continuous operation
    • Compatible with major PLC/DCS systems

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