Description
Overview
The IC200CHS006 is a VersaMax system communications carrier designed by GE Fanuc Emerson to serve as the physical and electrical foundation for VersaMax communication interface modules. It is specifically engineered to host IC200BEM series communication units and provide stable backplane integration within distributed control architectures.
The module enables reliable fieldbus connectivity and ensures proper signal exchange between network modules and the VersaMax backplane while maintaining mechanical stability and electrical grounding integrity.
System Function
This carrier acts as a dedicated base for communication modules, ensuring structured mounting and system-level connectivity.
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Hosts VersaMax communication modules (IC200BEM series)
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Provides backplane data and 5 V logic power interface
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Enables high-speed data exchange between network modules and CPU system
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Supports fieldbus architectures including PROFIBUS-DP, DeviceNet, and AS-Interface (module dependent)
Electrical Characteristics
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Backplane supply voltage: 5 VDC
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Current consumption: approx. 5 mA
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I/O data handling capacity: up to 244 bytes depending on installed communication module
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Designed for low-power logic interface operation
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Stable signal routing for network communication modules
Communication Capability
Depending on the installed IC200BEM module, supported network performance ranges include:
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Low-speed communication: 9.6 Kbaud
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High-speed communication: up to 12 Mbaud
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Variable data throughput depending on fieldbus protocol implementation
Mechanical Construction
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DIN rail mounting (35 mm standard EN 50022)
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Optional panel mounting via integrated latch points
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Compact carrier design optimized for dense cabinet layouts
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Secure module locking structure for vibration resistance
Weight: 0.46 lbs
Environmental Ratings
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Operating temperature range: 0°C to 60°C
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Storage temperature range: -40°C to 85°C
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Relative humidity tolerance: 10% to 95% non-condensing
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Maximum installation altitude: 1000 m without performance derating
Installation and Grounding
The IC200CHS006 is designed to snap directly onto a grounded DIN rail, providing EMC protection through conductive mounting. Proper grounding reduces electrical noise and ensures stable communication performance in electrically noisy environments.
Module installation is tool-free, with secure latch retention for quick replacement and maintenance.
Applications
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Fieldbus communication infrastructure in modular PLC systems
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Distributed I/O networking architectures
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Machine-level network communication nodes
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Compact control cabinet communication expansion
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Multi-protocol industrial networking systems
FAQ
Q1: Which modules are compatible with this carrier?
It is designed for VersaMax IC200BEM communication modules.
Q2: Does it provide power to communication modules?
Yes, it supplies 5 V backplane power and data interface support.
Q3: Can it be mounted without a DIN rail?
Yes, it supports optional panel mounting using integrated latch points.
