Description

Product Description

The IC200CHS001 from GE Fanuc (now Emerson) is a locally mounted barrier-style carrier designed for the VersaMax distributed I/O platform. It serves as the physical and electrical interface between field wiring and a single VersaMax I/O module, ensuring stable signal routing and reliable system integration.

Engineered for demanding industrial environments, this carrier incorporates high-isolation screw terminals and a robust backplane connector, supporting consistent performance under electrical noise, vibration, and varying load conditions. Its integrated design enables module replacement without rewiring, minimizing downtime during maintenance.

Key Technical Specifications

General Information

• Manufacturer: GE Fanuc / Emerson

• Model: IC200CHS001

• Product Type: Barrier-style I/O carrier

• Series: VersaMax I/O

• Orientation: Horizontal

• Mounting Type: DIN rail or panel mount

Electrical Characteristics

• Rated Voltage: 264 VAC (continuous)

• Surge Tolerance: Up to 300 VAC

• Current Rating:

• 2 A per terminal

• 8 A total across common/power bus

• Insulation Design: Barrier-separated terminals for enhanced safety

• Recommended Conductor: Copper wire, 90°C rated

Terminal & Wiring Details

• Terminal Count: 36 screw-type barrier terminals

• Supported Wire Size: AWG 22–14 (solid or stranded)

• Maximum I/O Capacity:

• 32 signal points

• 4 shared common/power connections

• Tightening Torque: 0.5–0.68 Nm

Mechanical Properties

• Dimensions (approx.): 110 × 66.8 × 50 mm

• Weight: 0.40 kg

• Mounting Options:

• Standard 35 mm DIN rail (EN 50022)

• Direct panel mounting

• Backplane Interface: Slide-in locking connector integrated into carrier

Environmental Conditions

• Operating Temperature Range: 0°C to +60°C

• Storage Temperature Range: –40°C to +70°C

• Installation Note: Grounded DIN rail recommended for optimal EMC performance

Functional Highlights

• Barrier-isolated terminals reduce risk of short circuits and cross-channel interference

• Designed for high-current discrete I/O applications

• Supports hot module insertion and removal without disturbing field wiring

• Provides strong mechanical retention for wiring in vibration-prone installations

• Maintains consistent electrical contact via integrated backplane connector

Typical Applications

• Discrete input/output interfacing in PLC systems

• Industrial control panels with high wiring density

• Process automation requiring reliable signal isolation

• Environments exposed to electrical interference or mechanical vibration

FAQ

Q: Can field wiring remain connected during module replacement?
A: Yes. The carrier allows I/O modules to be removed and installed without disconnecting field wiring, reducing maintenance time.

Q: What type of signals is this carrier best suited for?
A: It is optimized for discrete I/O signals, especially where higher current capacity and electrical isolation are required.

Q: Is shielding or grounding required?
A: While not mandatory, grounding the DIN rail is strongly recommended to improve noise immunity and system stability.

Specifications

• Brand: General Electric

Advantages

• High reliability in industrial environments
• Supports continuous operation
• Compatible with major PLC/DCS systems