Yokogawa F3BU13-0N FA-M3 Base Module The Yokogawa F3BU13-0N, also cataloged as the F3BU13-0N Base Module, operates as a dedicated hardware...
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Description
Yokogawa F3BU13-0N FA-M3 Base Module
The Yokogawa F3BU13-0N, also cataloged as the F3BU13-0N Base Module, operates as a dedicated hardware component for slot-based module hosting within FA-M3 controller platforms. It provides structured physical and electrical interconnection for CPUs, power units, and I/O modules, ensuring deterministic signal routing across the backplane.
Hardware Specifications
Parameter
Specification
ModelBrand
Yokogawa F3BU13-0N
Origin
Japan
Weight
0.47 kg (unpopulated)
Dimensions
13-slot standard rack, compatible with FA-M3 modules
OperatingTemp
0 to 55 degC
StorageTemp
-20 to 75 degC
RelativeHumidity
10% to 90% RH (non-condensing)
Atmosphere
Indoor use, free from corrosive or flammable gases
PowerConsumption
Dependent on installed modules; supports F3PU10-0S/F3PU20-0S power distribution
CoreFunction
Backplane connectivity for CPU, I/O, and expansion modules
Process Control Connectivity Features
The F3BU13-0N incorporates channel-to-channel isolation across the backplane, minimizing cross-talk between analog and digital I/O modules. It supports integration with 4-20 mA HART loop instruments and FOUNDATION Fieldbus/ProfibusPA modules, preserving signal fidelity and ensuring accurate process control. Cold junction compensation (CJC) support is maintained for temperature-sensitive analog channels when linked with compatible FA-M3 analog input modules.
Frequently Asked Questions
Q: VnA: Can modules be hot-swapped in the F3BU13-0N chassis? A: Only certain expansion and I/O modules support hot-swap; CPUs and power supplies must be powered down before removal or insertion.
Q: VnA: How is electrical isolation handled between slots? A: Each slot is electrically isolated with channel-to-channel barriers to prevent signal interference, supporting mixed analog and digital module populations.
Q: VnA: Are firmware updates for CPUs affected by the base module? A: Firmware flash compatibility is maintained across the backplane; updates should follow the FA-M3 CPU update procedure without additional base module intervention.