وصف

Yokogawa NFBU200-015 STARDOM Base Module

The Yokogawa NFBU200-015, also cataloged as the NFBU200 Base Module, operates as a dedicated hardware component for housing CPU, power, and I/O modules within the STARDOM control system.

Hardware Specifications

Parameter	Specification
ModelBrand	Yokogawa NFBU200-015
Origin	Japan
Weight	Approx. 1.0 kg (empty)
Dimensions	440 mm × 131 mm × 42.3 mm
OperatingTemp	-40 degC to +70 degC
StorageTemp	-40 degC to +85 degC
AmbientHumidity	5% to 95% RH, non-condensing
PowerConsumption	Supports single or duplexed power modules
ModuleSlots	10 (2 for power, 8 for CPU/I/O)
BusInterfaces	SB Bus and E2 Bus
Mounting	DIN rail or 19-inch rack
HotSwap	Supported for CPU, power, and I/O modules
ProtectionClass	IP20
ShockResistance	15 G, 11 ms (power-off)
VibrationResistance	0.15 mm P-P (5–58 Hz), 1 G (58–150 Hz)

Process Control Features

• Supports 4-20 mA HART loop protocol for analog I/O modules.
• FOUNDATION Fieldbus and Profibus PA connectivity supported for distributed I/O integration.
• Channel-to-channel isolation ensures electrical separation between I/O signals.
• Cold junction compensation (CJC) supported in temperature measurement modules when combined with compatible CPUs.

Frequently Asked Questions

Q: What is the maximum number of I/O modules with a single CPU?
A: Up to 8 I/O modules can be installed in a single CPU configuration.

Q: Are CPU and power modules hot-swappable?
A: Yes, both CPU and power modules support hot-swap without system shutdown.

Q: Can this module operate in high humidity environments?
A: Yes, it supports 5% to 95% RH non-condensing conditions.

Field Installation Guidelines

• Ensure DIN rail or 19-inch rack is properly grounded before module mounting.
• Maintain minimum spacing between modules for airflow and cabling.
• Avoid routing high-voltage cables parallel to SB/E2 backplane connections to prevent interference.
• Confirm that duplexed power modules are connected with proper polarity and voltage ratings.
• Use electrostatic discharge (ESD) precautions during installation and handling of modules.

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