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Schneider Electric TSXP47425 Processor Module
Configured for processing and scan-cycle execution in Modicon Premium backplane architecture, the Schneider Electric TSXP47425 (TSXP47425 Processor Module) provides direct physical/electrical execution within Modicon Premium PLC rack systems. The module performs centralized logic processing, I/O task scheduling, and communication handling through the rack backplane bus structure.
Suffix Breakdown & Model Matrix
TSXP47425 is a fixed ordering reference within the Modicon Premium processor family. No field-encoded suffix structure or functional sub-identifier segmentation is defined.
Hardware Specifications
| Parameter |
Specification |
| ModelBrand |
Schneider Electric TSXP47425 |
| Weight |
1.285 kg (packaged) |
| Dimensions |
10 cm x 23 cm x 23.5 cm (packaged) |
| OperatingTemp |
Not specified |
| PowerConsumption |
5 VDC, approx. 350 mA to 500 mA (backplane supply) |
| Memory Capacity |
128 KB internal RAM |
| Expanded Memory |
PCMCIA expansion supported |
| Max Digital I/O |
Up to 1024 points |
| Max Analog I/O |
Up to 80 channels |
| Application Tasks |
Master / Fast / Event-driven task execution |
| Communication Ports |
TER port, AUX serial interface |
| Slot Width |
Single-slot module |
Backplane Bus Communication and Deterministic Execution
The TSXP47425 processor operates on a deterministic backplane bus structure where scan cycle execution is synchronized with internal rack timing. I/O refresh operations are executed through cyclic memory mapping rather than external network arbitration. Backplane communication velocity is maintained through fixed scan scheduling, ensuring consistent task execution timing across distributed rack modules. Firmware-level task separation (master, fast, event) allows deterministic prioritization of process logic versus communication servicing without external jitter dependency.
Frequently Asked Questions
Q: Does the TSXP47425 support hot swapping during operation?
A: Hot swap capability depends on rack configuration, but processor removal under energized conditions is not supported. Power isolation is required prior to replacement.
Q: Can memory be expanded beyond internal RAM?
A: Yes. Expansion is supported via PCMCIA memory cards for application code and data storage extension.
Q: How is I/O synchronization handled across the rack?
A: I/O synchronization is executed through backplane cyclic refresh linked to PLC scan cycles, not through external communication networks.
Field Installation Guidelines
Install the module only into a compatible Modicon Premium rack slot with power removed. Ensure edge connector alignment before full insertion to avoid pin deformation. Maintain separation between communication wiring and high-power conductors to reduce electromagnetic coupling on serial interfaces. Verify battery presence prior to commissioning to prevent application memory loss during power interruption. Ensure rack grounding impedance meets standard industrial control cabinet grounding practices to stabilize backplane reference potential.
