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Schneider Electric BMXXBP1002 Modicon X80 Rack

Configured for backplane distribution and module interconnection in Modicon X80 rack-based PLC architectures, the Schneider Electric BMXXBP1002 (BMXXBP1002 Rack) provides direct physical/electrical execution for CPU, I/O, and communication module mounting across Modicon X80 platforms.

Suffix Breakdown & Model Matrix

• BMXXBP1002: Fixed rack assembly identifier for Modicon X80 backplane systems
• No additional suffix segmentation is defined in manufacturer documentation for functional variants within this order code

Hardware Specifications

Parameter	Specification
ModelBrand	Schneider Electric BMXXBP1002
Origin	France
Weight	1.37 kg (product), 1.384 kg (package)
Dimensions	Package: 59.0 x 15.3 x 6.6 cm
OperatingTemp	0 to 60 degC
PowerConsumption	251 mW at 3.3 VDC; 3.9 W at 24 VDC
Backplane Slots	8 bus X + Ethernet, 2 bus X
Electrical Interface	XBE expansion connector
Mounting	4 x M6 screws or 4 x 4.32 to 6.35 mm screws
Current Consumption	162 mA at 24 VDC; 76 mA at 3.3 VDC
IP Rating	IP20

Backplane Bus Communication Architecture (Schneider Electric PLC Systems)

Within Modicon X80 architectures, backplane communication is handled via deterministic rack-level bus coupling supporting CPU-to-I/O and CPU-to-communication module data exchange. The BMXXBP1002 rack provides a fixed-slot electrical plane where module addressing and internal data routing are synchronized through the backplane bus structure. IO density scaling is constrained by slot segmentation between bus X and Ethernet-enabled module groups, ensuring deterministic scan cycle alignment across installed processor and peripheral modules. Firmware compatibility is dependent on rack-level configuration alignment with BMXCPS4002 power modules and BMX processor families.

Frequently Asked Questions

Q: Can the BMXXBP1002 support mixed CPU and I/O module installation?
A: Yes. The rack is designed to accommodate BMX processor modules, I/O modules, and specific application modules through segmented backplane bus slots.

Q: Does the rack impose backplane current limitations per slot?
A: Yes. Current distribution is governed by the system power supply (e.g., BMXCPS4002), with backplane load sharing defined at rack level rather than per individual slot.

Q: Is hot-swap supported for modules installed on this rack?
A: Module hot-swap capability depends on the installed CPU and system configuration; the rack itself provides passive electrical interconnection without switching logic.

Field Installation Guidelines

The BMXXBP1002 shall be installed using 4-point mechanical fixation on a metallic panel or mounting plate. Ensure uniform torque distribution across M6 mounting points to prevent backplane deformation. Maintain clearance for ventilation within 0 to 60 degC operating range. Shield grounding should be applied at panel level to minimize EMI coupling across Ethernet backplane segments. All BMX-series modules must be inserted perpendicular to the rack plane to avoid backplane connector damage or misalignment.

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