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GE IS200SRLYH2AAA Relay Output Terminal Board
Configured for discrete relay actuation in Mark VI / Mark VIe turbine control I/O architecture, the GE IS200SRLYH2AAA (IS230SNRLH2A Relay Output Terminal Board) provides direct physical switching of field loads through onboard electromechanical relay outputs within a simplex control backplane topology.
The board executes 12-channel Form-C relay switching for solenoids, contactors, and alarm circuits, interfacing between controller output packs and external load wiring via pluggable terminal interfaces and D-shell connectivity. Signal paths are routed through isolated contact pairs intended for discrete state transmission to I/O processing layers.
Suffix Breakdown & Model Matrix (Model Structure Interpretation)
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Base Model: IS230SNRLH2A
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Full Assembly: IS200SRLYH2AAA
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Functional Class: Simplex relay output terminal board
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Series Mapping: Mark VI / Mark VIe I/O carrier ecosystem
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Revision Handling: Backward-compatible hardware revisions (no field-defined functional segmentation provided in source data)
Hardware Specifications
| Parameter |
Specification |
| Model |
IS200SRLYH2AAA (IS230SNRLH2A) |
| Brand |
General Electric (GE) |
| Origin |
USA |
| Weight |
0.6 kg |
| Operating Temp |
-30 deg C to +65 deg C |
| Power Consumption |
Backplane-fed (exact value not specified) |
| Relay Channels |
12 Form-C (SPDT) |
| Contact Ratings |
24 VDC @ 5 A; 48 VDC @ 1.2 A; 125 VDC @ 0.6 A |
| Mounting |
Panel-mounted on sheet metal carrier |
| Connectors |
Euro-style pluggable terminals; D-shell female |
| Coating |
Conformal coating |
| Certifications |
ANSI/ISA-12.12.01-2015; UL E2067685 Class 1 Zone 2 IIC |
GE Mark VI / Mark VIe Backplane I/O Execution Behavior
The IS200SRLYH2AAA interfaces to GE Mark VI/Mark VIe distributed I/O structures through deterministic backplane communication paths used for relay state mapping and output image synchronization. In simplex configuration, relay drive commands are executed without voting logic redundancy, with I/O packs handling output state latching and feedback confirmation.
The relay output topology supports channel-to-channel electrical isolation consistent with discrete control segmentation. Switching behavior is constrained by electromechanical relay response time, while system-level coordination is governed by controller scan cycle timing and backplane update intervals. Firmware and I/O mapping compatibility is dependent on Mark VI/Mark VIe revision alignment and configuration database consistency.
Frequently Asked Questions (FAQ)
Q: Can the IS200SRLYH2AAA be hot-swapped during system operation?
A: Hot-swap behavior depends on rack configuration and I/O carrier implementation. Electrical isolation via backplane does not eliminate arc risk under live inductive load conditions.
Q: What is the limitation of using simplex relay architecture in redundant systems?
A: Simplex architecture provides single-channel execution without 2oo3 voting. It is not natively aligned with TMR synchronization or redundant output validation logic.
Q: Are all relay outputs electrically isolated from each other?
A: Relay contacts are isolated per Form-C channel, but system-level grounding and return paths depend on panel wiring design and carrier implementation.
Field Installation Guidelines
Install the board on a grounded metal carrier with verified chassis bonding continuity. Maintain separation between high-voltage relay load wiring and low-level control wiring to prevent induced coupling. Terminal block conductors must be fully seated with torque consistent with industrial pluggable connector specifications. Shielded cable termination should follow single-point grounding practice at cabinet entry. Avoid routing inductive loads without suppression elements such as RC snubbers or flyback diodes. Ensure system power is removed before insertion or removal unless rack design explicitly supports energized maintenance.
