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GE DS200TCCBG3B Common Extended Analog I/O Board

Configured for extended analog signal acquisition and conditioning in GE Speedtronic Mark V control systems, the GE DS200TCCBG3B (DS200TCCBG3B Common Extended Analog I/O Board) provides direct physical/electrical execution.

Suffix Breakdown & Model Matrix

The DS200TCCBG3B is provided as a fixed GE Speedtronic Mark V hardware part number. Available documentation identifies the complete ordering code but does not define independent field-selectable suffix options.

Model Element	Description
DS200	GE Speedtronic Mark V board family identifier
TCCB	Functional acronym for Common Extended Analog I/O Board
G3B	Board group and functional revision identifier
TC2000	Analog expansion board designation

Hardware Specifications

Parameter	Specification
Model	DS200TCCBG3B
Brand	General Electric (GE)
Origin	United States of America
Weight	1.00 lbs
Series	Speedtronic Mark V
Board Type	Common Extended Analog I/O Board
Functional Acronym	TCCB
Functional Description	Extended Analog I/O Card
Processor	Intel 80196 onboard microprocessor
Memory	Multiple EPROM / PROM modules
Connectors	2 x 50-pin connectors and 5 x 34-pin ribbon connectors
Diagnostic Indicator	1 x green edge-visible diagnostic LED
PCB Coating	Standard conformal industrial coating
Functional Revision	Revision B

Firmware Flash Compatibility and Mark V Control Architecture

The DS200TCCBG3B operates as an analog expansion interface within the GE Speedtronic Mark V turbine control platform. The board extends analog I/O capacity by providing additional signal acquisition paths and conditioning circuits between field devices and the Mark V control processor architecture.

The onboard Intel 80196 microprocessor manages local board functions, while EPROM and PROM memory devices store board-specific operating firmware. Firmware flash compatibility is determined by the installed Mark V hardware revision and configured control system software.

The board communicates through dedicated ribbon cable connections using the Mark V internal control architecture. Proper I/O density scaling depends on the installed rack configuration and available system interface capacity.

Frequently Asked Questions

Q: Does the DS200TCCBG3B operate as a standalone controller?
A: No. The board functions as an analog I/O expansion interface and operates as part of the GE Speedtronic Mark V control system.

Q: What processor is installed on the DS200TCCBG3B?
A: The board contains an Intel 80196 onboard microprocessor for local board-level processing functions.

Q: Is the DS200TCCBG3B hot-swappable during system operation?
A: Available documentation does not specify hot-swap capability. Power removal and system shutdown procedures should be followed before board replacement.

Field Installation Guidelines

Install the DS200TCCBG3B in the designated GE Speedtronic Mark V rack position according to the applicable GE hardware installation manual.

Verify all ribbon cable connections before energizing the control system. Inspect connector alignment and ensure that cable routing maintains separation from high-current power conductors to reduce electrical interference.

Maintain PCB handling procedures to prevent electrostatic discharge damage to processor and memory components. Confirm board revision compatibility before installation into an existing Mark V configuration.

Connect field signal wiring with appropriate shielding and grounding practices. Avoid routing low-level analog signal conductors parallel to high-voltage switching circuits.

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