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Schneider Electric TSXP57303AM Double-Format PL7 Processor

Configured for deterministic logic execution in the Modicon Premium Automation platform, the Schneider Electric TSXP57303AM, also referenced as the TSXP57 double-format PL7 processor, provides direct physical backplane communication and discrete/analog I/O processing.

Hardware Specifications

Parameter	Specification
Brand	Schneider Electric
Model	TSXP57303AM
Origin	France
Weight	0.52 kg
Dimensions	95 mm x 180 mm x 260 mm
Operating Temp	0 to 60 degC
Power Consumption	1000 mA @ 5 V DC
Discrete I/O Capacity	1024 points
Analog I/O Capacity	128 points
Process Control Channels	15 to 45 simple loops
Serial Link	Non-isolated, 19.2/115 kbit/s, female mini DIN
System Overhead	0.29 ms fast task, 1.15 ms master task
Pollution Degree	2
Protection Rating	IP20

Backplane Bus Communication and Firmware Flash Compatibility

The TSXP57303AM utilizes the Modicon Premium backplane bus architecture for deterministic data exchange between processor and I/O modules. Firmware revisions must match the installed PL7 software version; mismatched flash loads will prevent task scheduling. The processor supports up to 8 AS-Interface bus modules and 3 network modules concurrently, with reduced fieldbus capacity when CANopen is active.

Frequently Asked Questions

Q: Can the TSXP57303AM be hot-swapped while the rack remains powered?

A: No. The module must be inserted or removed only after removing 5 V DC backplane power to avoid corruption of volatile memory and I/O mapping tables.

Q: What is the maximum analog input loading per rack with this processor?

A: The processor supports up to 128 analog I/O points distributed across all connected racks, regardless of slot population density.

Q: Does firmware downgrade require reconfiguration of application logic?

A: Downgrading may cause incompatibility with certain process control function blocks; verify PL7 software compatibility before flashing older firmware.

Field Installation Guidelines

Mount the TSXP57303AM into a grounded, metallic DIN rail assembly within an IP20-rated enclosure. Maintain clearance for heat dissipation—minimum 50 mm above and below the module. Use shielded twisted-pair cabling for serial links and connect shield drains directly to the rack ground bar. Avoid routing signal wiring parallel to high-current AC feeders to minimize inductive coupling. Verify backplane seating by checking RUN LED status after power-up.

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