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Schneider Electric TSXAEY1600 Analog Input Module
The TSXAEY1600, also cataloged as the TSX Micro analog input module, operates as a dedicated hardware component for multirange signal acquisition within Modicon Premium automation platforms.
Suffix Breakdown & Model Matrix
Code
Definition
TSX
Schneider Electric TSX Micro / Premium Series Prefix
A
Analog I/O Category
EY
High-Level Input Module Type
1600
16-Channel Configuration
Hardware Specifications
Parameter
Specification
Model Brand
Schneider Electric
Origin
France
Weight
0.45 kg
Dimensions
Standard TSX Micro Format
Operating Temp
0 to 60 degC
Storage Temp
-25 to 70 degC
Power Consumption
270 mA at 5 V DC
Analog Input Channels
16 High-Level Inputs
Input Types
Current 0...20 mA, 4...20 mA; Voltage +/- 10 V, 0...10 V, 0...5 V, 1...5 V
Resolution
12 bits
Isolation
1000 Vrms (Channel-Bus, Channel-Ground)
Electrical Connection
2 x SUB-D 25 Connectors
Relative Humidity
10% to 95% (Non-condensing)
Backplane Bus Communication and Firmware Flash Compatibility
The module interfaces with the Modicon Premium backplane via a parallel data bus, executing deterministic scan cycles. The nominal read cycle time is fixed at 51 ms for all 16 channels, while the fast read cycle executes in 3 ms plus 3 ms per active channel. Firmware compatibility is strictly tied to the specific CPU processor generation; mixing TSX Micro modules with later-generation Magelis or M340 platforms requires explicit firmware validation to prevent addressing errors on the bus coupler.
Frequently Asked Questions
Q: What is the measurement error tolerance for this module at ambient temperature?
A: The measurement error is specified at 0.1% of full scale at 25 degC. Field accuracy may drift according to the thermal coefficient specified in the general catalog for temperatures outside this range.
Q: Can the TSXAEY1600 be hot-swapped on a live rack?
A: No. The module is not rated for live insertion. Power must be removed from the rack before installation or removal to prevent backplane bus faults and potential damage to the I/O circuitry.
Q: Is individual channel isolation provided?
A: No. While the module provides 1000 Vrms isolation between the channel group and the bus/ground, there is no isolation between individual input channels. Common mode voltage limits must be observed.
Field Installation Guidelines
Mount the module into the TSX Micro rack ensuring the bus connector is fully engaged. Use shielded twisted pair cabling for all analog inputs. Terminate the shield drain wire to the designated ground point on the DIN rail or mounting plate; do not connect the shield at the module end to avoid ground loops. Verify that the input overvoltage protection limits (-15 to 15 V at state 0, -30 to 30 V at state 1) are not exceeded by field wiring during power-up sequences.
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