GE DS200LDCCH1ANA Drive Control CPU Board Configured for executing motor control algorithms and SCR firing angle calculations in GE Mark...
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Keterangan
GE DS200LDCCH1ANA Drive Control CPU Board
Configured for executing motor control algorithms and SCR firing angle calculations in GE Mark IV LCI systems, the GE DS200LDCCH1ANA (DS200LDCC Drive Control CPU Board) provides direct physical/electrical execution. This module coordinates drive control functions and executes real-time fault detection logic without relying on external supervisor units.
Hardware Specifications
Parameter
Specification
Model
DS200LDCCH1ANA
Brand
GE
Origin
USA
Weight
1.20 kg
Operating Temp
0 to 50 deg C
Power Consumption
15 W at 24 VDC
Input Voltage
24 VDC nominal (18-32 VDC range)
Processor
Dedicated drive control CPU
Bus Architecture
MARK IV / QDII bus protocol
Onboard Memory
NVRAM with battery backup
Battery Type
3.6 V lithium thionyl chloride
Diagnostics
Power, Run, Fault, Communication LEDs
Brand-Specific Technical Features
The DS200LDCCH1ANA interfaces directly through the proprietary QDII backplane bus communication structure to manage high-speed motor control data exchanges. Firmware flash compatibility and onboard NVRAM maintain deterministic execution loops for SCR firing angles, eliminating communication delays across the backplane bus interface.
Frequently Asked Questions
Q: What is the purpose of the onboard 3.6 V lithium battery?
A: The onboard battery provides backup power to the NVRAM, ensuring that calibrated drive parameters and diagnostic fault logs remain intact during system power shutdowns.
Q: Can the DS200LDCCH1ANA be hot-swapped while the LCI system is operational?
A: No. Power to the rack must be completely isolated before removing or inserting the board to prevent backplane bus disturbance and potential damage to onboard semiconductors.
Field Installation Guidelines
Power down the drive cabinet and verify zero-voltage state on the 24 VDC supply before board handling.
Wear a grounded wrist strap connected to the enclosure frame to prevent electrostatic discharge damage.
Align the board edges with the Mark IV card guide slots and slide in until the rear edge connectors seat into the QDII bus backplane.
Tighten the retaining screws on the front panel to ensure solid chassis grounding and mechanical stability.
