GE DS200DTBCG1AAA Mark V Termination Module Configured for dry contact relay outputs in GE Mark V Speedtronic systems, the GE DS200DTBCG1AAA (DS200DTBC Contact...
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GE DS200DTBCG1AAA Mark V Termination Module
Configured for dry contact relay outputs in GE Mark V Speedtronic systems, the GE DS200DTBCG1AAA (DS200DTBC Contact Output Termination Module) provides direct physical/electrical execution.
The board utilizes high-speed backplane bus communication velocity to process incoming control commands from the primary Speedtronic processor card. The onboard logic decodes these backplane instructions into immediate coil excitation across 16 independent relays. Integrated flyback diodes parallel to each relay coil suppress transient inductive voltage spikes during de-energization, maintaining signal integrity across adjacent control lines. Solid-state decoupling via a 22 uF filter capacitor stabilizes the incoming +5 VDC rail during simultaneous multi-channel switching.
Frequently Asked Questions
Q: Does replacing the DS200DTBCG1AAA require a system power reboot?
A: Yes. The module interfaces directly with the Mark V edge connector and VME backplane. Removing or inserting the card while the backplane is energized at +5 VDC can cause bus disruption, command failure, or electrical stress on the edge connectors.
Q: What is the primary function of the 16 onboard flyback diodes?
A: They function as inductive flyback voltage clamp circuits across each relay coil. When an output channel turns off, inductive energy stored in the solenoid or coil discharges harmlessly through the diode, protecting the upstream control logic and minimizing backplane EMI noise.
Q: Can the contact outputs drive higher inductive loads directly without external suppression?
A: The maximum rating is strictly 2 A at 30 VDC or 0.5 A at 125 VAC per channel. High-inductance field loads exceeding these thresholds or operating above the voltage limits require external interposing relays or secondary arc suppression across the field terminals.
Field Installation Guidelines
Power Isolation: Ensure power to the Mark V control rack is completely isolated before servicing or replacing the termination module.
Electrostatic Discharge (ESD) Protection: Wear a grounded wrist strap attached to the chassis ground before handling the card to prevent damage to sensitive backplane interface components.
Card Slot Alignment: Carefully slide the module into the designated single-slot guide within the Mark V rack. Align the card edge connector with the VME backplane socket and apply firm, even pressure until fully seated.
Field Terminal Wiring: Secure external relay field wiring through the 37-pin D-sub cable assemblies. Ensure connector retaining screws are tightened securely to maintain mechanical connection under vibration.
Shielding & Grounding: Maintain proper cable shielding across field wiring runs. Ground cable shields at one single point within the enclosure to avoid ground loops that could interfere with low-voltage logic operations.
