Keterangan
Description
The ABB 5SHX1445H0002 (3BHL000387R0101) is a high-performance Integrated Gate-Commutated Thyristor (IGCT) power semiconductor module designed for demanding industrial power electronics. This assembly integrates the 5SHX1445H0002 asymmetric reverse-conducting IGCT thyristor chip with the 3BHB003386R0101 (5SXE05-0153) gate driver unit in a single, robust press-pack package. By combining the high-speed switching of IGBTs with the low conduction losses and high blocking voltage of GTO thyristors, this module is optimized for medium-voltage drive systems and high-power converters.
Features
- High-power IGCT switching module for 4.5 kV-class medium-voltage applications.
- Integrated gate driver unit (5SXE05-0153) for precise, high-current gate control pulses.
- Fiber optic communication for galvanic isolation between control and power layers.
- Low conduction and switching losses with fast turn-off characteristics.
- Robust press-pack housing designed for integration into water-cooled stacks.
Applications
- Medium-voltage motor drives (e.g., ACS6000, PCS6000 platforms).
- HVDC transmission and grid stabilization systems.
- Marine propulsion systems and heavy industrial converters.
- Rail transport propulsion and auxiliary power converters.
- Wind turbine power conversion stages.
Technical Specifications
| Model |
5SHX1445H0002 / 3BHL000387R0101 |
| Gate Unit |
5SXE05-0153 / 3BHB003386R0101 |
| Rated Blocking Voltage (VDRM/VRRM) |
4,500 V |
| Rated Current (IT(AV)) |
1,445 A |
| Peak Forward Current |
2,200 A |
| Conduction Voltage Drop |
2.5 V |
| Turn-off Time |
≤ 1 µs |
| Gate Supply Voltage |
+15 V DC |
| Gate Trigger Current |
0.5 A |
| Short-Circuit Withstand |
10 kA |
| Thermal Resistance (Rth(j-c)) |
0.1 degC/W |
| Max Junction Temperature |
150 degC |
Installation Guidelines
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Handling: Handle the press-pack housing by the edges only. Do not touch the ceramic collar or copper pole faces with bare hands to avoid oil and contamination.
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Alignment: Ensure perfect alignment of the IGCT between the upper and lower water-cooled heat sinks.
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Clamping Force: This device requires a strict, uniform clamping force (typically 40 kN). Use a calibrated torque wrench or hydraulic press to tighten the stack spring according to the specific ABB hardware manual.
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Cooling: Thermal management requires efficient water cooling or an appropriate heatsink to maintain junction temperatures within rated limits.
FAQ
What is this 5SHX1445H0002?
It is a high-performance semiconductor switching module that combines a central power thyristor wafer with an integrated, closely coupled gate driver board.
What are its primary voltage and current ratings?
The module is rated for a peak voltage class of 4500 V (4.5 kV) and a continuous anode current threshold of 1445 A.
How does the gate driver communicate with the main control rack?
The integrated gate unit communicates using fiber optic links, which provides absolute galvanic isolation and safeguards low-voltage control layers from the high-voltage power paths.
What are the mechanical mounting constraints?
Because it uses a standard press-pack configuration, it requires a precise and uniform clamping force of 40 kN. Incorrect mounting force will lead to irregular parallel contact resistance profiles and potential component failure.
