{"product_id":"ge-ds200sdccg1aec-mark-v-speedtronic-drive-control-board","title":"GE DS200SDCCG1AEC Mark V Speedtronic Drive Control Board","description":"\u003ch2\u003eGE DS200SDCCG1AEC Mark V Speedtronic Drive Control Board\u003c\/h2\u003e\n\u003cp\u003eConfigured for high-speed algorithm processing and real-time turbine coordination in Speedtronic control racks, the \u003cstrong\u003eGE DS200SDCCG1AEC\u003c\/strong\u003e (\u003cstrong\u003eDS200SDCC\u003c\/strong\u003e Drive Control Board) provides direct physical\/electrical execution. The board integrates three 16-bit digital signal processors (DSPs) to administer motor control timing, firing angle calculation for power electronic bridges, and local sub-system diagnostics. It interacts directly with power interface boards and field sensors through specialized signal distribution hardware over dedicated backplane pathways.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDS200SDCCG1AEC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.96 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e160 mm x 233 mm x 20 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 deg C to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e+5 VDC at 6.0 A, +15 VDC at 0.5 A, +24 VDC at 0.2 A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProcessing Architecture\u003c\/td\u003e\n\u003ctd\u003e3 x 16-bit DSPs (Master, Communications, I\/O)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOnboard Memory\u003c\/td\u003e\n\u003ctd\u003e128 kB Dual-Port RAM, 256 kB EPROM Firmware\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAnalog Outputs\u003c\/td\u003e\n\u003ctd\u003e12-bit isolated, -10 VDC to +10 VDC, 5 mA maximum load\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eServo Channels\u003c\/td\u003e\n\u003ctd\u003e2 channels, jumper-selectable 10 mA to 120 mA coil current\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLVDT Sensor Interface\u003c\/td\u003e\n\u003ctd\u003e6 differential inputs, 3-wire or 4-wire selectable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDigital Field I\/O\u003c\/td\u003e\n\u003ctd\u003e64 opto-isolated inputs, 32 relay outputs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBus Communication Interface\u003c\/td\u003e\n\u003ctd\u003eDLAN, ARCNET, RS-232 TIMN port, Genius Bus support\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eElectrical Isolation\u003c\/td\u003e\n\u003ctd\u003e1500 VDC field-to-logic, 2.5 kV optical isolation\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity \u0026amp; Firmware Flash Compatibility\u003c\/h3\u003e\n\u003cp\u003eThe DS200SDCC board relies on high-speed deterministic bus communication interfaces to exchange state variables across the drive rack backplane without CPU blocking. Dual-port RAM (DPRAM) buffers data between the internal DSP cores and external fieldbus protocols, eliminating data bus contention. Firmware execution depends on strict flash\/EPROM chip set alignment across all three processors. Mismatched firmware versions among the processing nodes cause state desynchronization, triggering fault codes and safe shutdown sequences during boot initialization.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How are the onboard servo channel output currents configured for different valve actuators?\u003c\/p\u003e\n\u003cp\u003eA: Coil currents on the 2 servo control channels are established via physical hardware jumper blocks on the printed circuit board. Jumpers must be configured in deactivated-power states to match the target 10 mA to 120 mA rating before connecting actuator leads.\u003c\/p\u003e\n\u003cp\u003eQ: Does the board support live hot-swapping inside a powered VME rack?\u003c\/p\u003e\n\u003cp\u003eA: No. Replacing the board while the backplane is energized risks voltage transients, corrupted EPROM states, and potential power supply shorts. Always disconnect main power and lock out the supply before extraction.\u003c\/p\u003e\n\u003cp\u003eQ: What step is required when transferring configurable settings to a replacement DS200SDCC board?\u003c\/p\u003e\n\u003cp\u003eA: Configuration parameters and site-specific operational data are stored in removable EPROM or EEPROM chips. These memory chips must be transferred carefully from the existing board to the new board using anti-static handling tools prior to installation.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eESD Protection Protocols:\u003c\/strong\u003e Wear a grounded wrist strap connected to an unpainted metal chassis ground point before touching the card. Hold the circuit board strictly by its front faceplate or plastic card edges to prevent static discharge into exposed DSP leads.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis \u0026amp; Mechanical Mounting:\u003c\/strong\u003e Ensure the target 6U VME rack slot is free of debris. Align the board edges with the card guides and push firmly until the board seats fully into the backplane connectors. Secure the top and bottom retaining screws to achieve solid chassis grounding.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCable Strain Relief \u0026amp; Routing:\u003c\/strong\u003e Route incoming ARCNET, DLAN, and analog sensor field cables away from high-voltage AC lines and switching power leads. Fasten all ribbon and communication cables with mechanical strain relief ties to minimize physical stress on board header pins.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eShield Grounding Practices:\u003c\/strong\u003e Field signal cable shields (LVDT, servo feedback, analog outputs) must be grounded at a single point—typically at the designated ground bar in the enclosure—to prevent ground loops and high-frequency noise interference on measurement circuits.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":44472995610712,"sku":"DS200SDCCG1AEC","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0670\/2039\/0488\/files\/DS200SDCIG2AGB_43ba4580-8735-45e0-88ae-377a69edcc8f.jpg?v=1785233885","url":"https:\/\/www.industriaxplc.com\/products\/ge-ds200sdccg1aec-mark-v-speedtronic-drive-control-board","provider":"IndustriaX Limited","version":"1.0","type":"link"}