{"product_id":"ge-ds200tcdah1b-mark-v-digital-i-o-board","title":"GE DS200TCDAH1B Mark V Digital I\/O Board","description":"\u003ch2\u003eGE DS200TCDAH1B Mark V Digital I\/O Board\u003c\/h2\u003e\n\u003cp\u003eConfigured for discrete signal interfacing and isolated loop monitoring in the Mark V Speedtronic network, the \u003cstrong\u003eGE DS200TCDAH1B\u003c\/strong\u003e (\u003cstrong\u003eDS200TCDA\u003c\/strong\u003e Digital I\/O Board) provides direct physical\/electrical execution. It handles 16 optically isolated input channels and 16 output relay drive channels, utilizing an onboard microprocessor with PROM firmware for input debouncing, output conditioning, and proprietary IONET data transmission to the TCQC controller cores.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cp\u003eThe part number nomenclature defines specific hardware configurations for field deployment:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eDS200: Base board assembly designation for Mark V modules\u003c\/li\u003e\n\u003cli\u003eTCDA: Digital I\/O board functional acronym\u003c\/li\u003e\n\u003cli\u003eH: Conformal coating applied to the PCB for harsh environments\u003c\/li\u003e\n\u003cli\u003e1: Functional revision 1\u003c\/li\u003e\n\u003cli\u003eB: Hardware\/Artwork revision B\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDS200TCDAH1B\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGeneral Electric (GE)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eFactory Standard\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.23 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e178 x 101 x 30 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-20 deg C to +60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temp\u003c\/td\u003e\n\u003ctd\u003e-40 deg C to +85 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eDependent on host backplane load\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInputs\u003c\/td\u003e\n\u003ctd\u003e16 digital channels, dry contact (24 VDC nominal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutputs\u003c\/td\u003e\n\u003ctd\u003e16 digital channels, relay drive (up to 500 mA)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation Rating\u003c\/td\u003e\n\u003ctd\u003eOptical isolation, 2500 Vrms test\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eConnectors\u003c\/td\u003e\n\u003ctd\u003eDual 50-pin IDC (JQ\/JR), JO1\/JO2 outputs, JX1\/JX2 IONET\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eConfiguration\u003c\/td\u003e\n\u003ctd\u003e8 hardware jumpers (JP1 to JP8)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIndicators\u003c\/td\u003e\n\u003ctd\u003e10 LED status blocks + 1 system LED\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePCB Protection\u003c\/td\u003e\n\u003ctd\u003eConformal coating (H-suffix)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity \u0026amp; I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe module leverages deterministic backplane bus communication velocity through the proprietary IONET architecture, ensuring synchronized data transfer with the TCQC processor matrix. Firmware flash compatibility is governed by the physical PROM chips socketed on the PCB; operational logic upgrades require physical PROM replacement rather than network-based flashing. I\/O density scaling is fixed at 16 inputs and 16 outputs per module, mapped directly to the Q11, Q21, or Q51 Mark V core memory registers without localized protocol conversion latencies.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What are the primary termination points for the IONET communication on this module?\u003c\/p\u003e\n\u003cp\u003eA: The module interfaces with the IONET network via dual 50-pin IDC connectors designated as JX1 and JX2 on the printed circuit board.\u003c\/p\u003e\n\u003cp\u003eQ: How are address and termination settings handled during hardware replacement?\u003c\/p\u003e\n\u003cp\u003eA: Hardware configuration utilizes 8 manual jumpers (JP1 through JP8). These jumpers dictate network addressing, termination resistance, stall timer parameters, and test mode activation. They must be physically mapped to match the legacy board exactly before chassis insertion.\u003c\/p\u003e\n\u003cp\u003eQ: Does the DS200TCDAH1B support live hot-swapping within an active Mark V core?\u003c\/p\u003e\n\u003cp\u003eA: Standard field practice requires powering down the respective control core (Q11, Q21, or Q51) prior to removal or insertion to prevent backplane bus faults or electrical surges through the primary JQ and JR header blocks.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eVerify core power is completely isolated before engaging the base frame or manipulating internal cables.\u003c\/li\u003e\n\u003cli\u003eSeat the dual 50-pin IDC connectors (JQ and JR) evenly with equal pressure to avoid pin bending or improper contact with the backplane traces.\u003c\/li\u003e\n\u003cli\u003eTransfer all jumper settings (JP1 to JP8) from the removed board prior to installation. Visually validate stall timer and termination states against site specific documentation.\u003c\/li\u003e\n\u003cli\u003eEnsure shield drains for field wiring are landed on the designated chassis grounding bars, maintaining strict galvanic separation from the 24 VDC logic power rails.\u003c\/li\u003e\n\u003cli\u003eObserve the 10-LED diagnostic array upon initial power-up. The primary system run\/fault LED must stabilize in its normal operating state before putting the turbine control loop back into active service.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":44476812525656,"sku":"DS200TCDAH1B","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0670\/2039\/0488\/files\/DS200TCDAH1BHJE_28f445d1-c1e6-4e24-81a9-8541ff61473a.jpg?v=1785318538","url":"https:\/\/www.industriaxplc.com\/id\/products\/ge-ds200tcdah1b-mark-v-digital-i-o-board","provider":"IndustriaX Limited","version":"1.0","type":"link"}