{"product_id":"base-unit-yokogawa-f3bu20-0n-fa-m3","title":"Base Unit | Yokogawa F3BU20-0N | FA-M3","description":"\u003ch2\u003eYokogawa F3BU20-0N FA-M3 Base Unit\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eYokogawa F3BU20-0N\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eF3BU20-0N\u003c\/strong\u003e base unit, operates as a dedicated hardware component for backplane slot distribution and module interconnection within the FA-M3 platform. It provides mechanical mounting and electrical bus continuity for CPU, power supply, and I\/O modules in a modular PLC architecture based on the FA-M3 system.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cp\u003eNo validated manufacturer-published sub-division or functional suffix decoding is provided for the F3BU20-0N base unit. The \"-0N\" designation is treated as a catalog revision identifier without exposed functional segmentation in available technical documentation.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel \/ Brand\u003c\/td\u003e\n\u003ctd\u003eYokogawa F3BU20-0N\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eJapan\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eModule Type\u003c\/td\u003e\n\u003ctd\u003eFA-M3 Base Unit (Backplane Rack)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Capacity\u003c\/td\u003e\n\u003ctd\u003e20 Slots\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 degC to 55 degC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temp\u003c\/td\u003e\n\u003ctd\u003e-20 degC to 75 degC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e0.25 A @ 5 VDC (internal backplane load)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBackplane System\u003c\/td\u003e\n\u003ctd\u003eFA-M3 module bus distribution\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInsulation Withstand\u003c\/td\u003e\n\u003ctd\u003e500 VAC (1 min, frame to FG)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInsulation Resistance\u003c\/td\u003e\n\u003ctd\u003e\u0026gt;= 10 MOhm @ 500 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling Method\u003c\/td\u003e\n\u003ctd\u003eNatural convection\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting\u003c\/td\u003e\n\u003ctd\u003eCabinet-mounted rack system\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch2\u003eProcess Control Backplane Architecture\u003c\/h2\u003e\n\u003cp\u003eThe F3BU20-0N implements passive backplane distribution for FA-M3 system modules, maintaining deterministic electrical routing across CPU, power supply, and I\/O cards. Signal and power integrity is maintained through internal bus coupling rather than active switching logic.\u003c\/p\u003e\n\u003cp\u003eWithin the FOUNDATION Fieldbus H1 and RS-485 mixed-architecture environments, the base unit serves as a structural carrier only, while communication execution is handled at module level. Channel-to-module electrical isolation is determined by installed I\/O hardware rather than the base chassis.\u003c\/p\u003e\n\u003cp\u003eBackplane current distribution is regulated by the installed power supply module, and total system loading is constrained by cumulative module consumption across all 20 slots.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Does the F3BU20-0N support hot-swap of FA-M3 modules?\u003c\/strong\u003e\u003cbr\u003eA: Module hot-swap capability is determined by individual FA-M3 CPU and I\/O modules. The base unit itself provides passive bus structure without switching isolation.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: What limits backplane current loading?\u003c\/strong\u003e\u003cbr\u003eA: Backplane loading is constrained by the installed power supply module and cumulative 5 VDC consumption across all inserted modules within the 20-slot structure.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Can mixed communication modules be installed in the same base unit?\u003c\/strong\u003e\u003cbr\u003eA: Yes. FA-M3 architecture supports mixed configuration of I\/O, CPU, and communication modules, provided slot power and bus limits are not exceeded.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eThe base unit shall be installed inside a grounded industrial control cabinet with verified protective earth continuity. Mechanical fastening must ensure uniform rack alignment to avoid backplane connector stress.\u003c\/p\u003e\n\u003cp\u003eAll modules must be inserted with controlled axial force to prevent misalignment of bus pins. Shield grounding must be terminated at cabinet earth reference point, avoiding floating potential between rack segments.\u003c\/p\u003e\n\u003cp\u003eCable routing for communication modules (including RS-485 and fieldbus interfaces) must maintain separation from high-voltage power conductors to reduce induced noise coupling into the backplane environment.\u003c\/p\u003e","brand":"Yokogawa","offers":[{"title":"Default Title","offer_id":44182261235800,"sku":"F3BU20-0N","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0670\/2039\/0488\/files\/F3BU20-0N-2.jpg?v=1780545429","url":"https:\/\/www.industriaxplc.com\/id\/products\/base-unit-yokogawa-f3bu20-0n-fa-m3","provider":"IndustriaX Limited","version":"1.0","type":"link"}