{"product_id":"ge-ds200tccbg3ane-mark-v-vi-thermocouple-analog-input-board","title":"GE DS200TCCBG3ANE Mark V\/VI Thermocouple\/Analog Input Board","description":"\u003ch2\u003eGE DS200TCCBG3ANE Mark V\/VI Thermocouple\/Analog Input Board\u003c\/h2\u003e\n\u003cp\u003eConfigured for precise temperature and sensor signal acquisition in GE Mark V\/Mark VI turbine control networks, the \u003cstrong\u003eGE DS200TCCBG3ANE\u003c\/strong\u003e (\u003cstrong\u003eDS200TCCB\u003c\/strong\u003e Thermocouple\/Analog Input Board) provides direct physical\/electrical execution. It directly samples millivolt-level thermocouple outputs, applies per-channel cold junction compensation, and converts field signals to 16-bit digital values across isolated backplane interfaces to ensure stable turbine operation.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDS200TCCBG3ANE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.48 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e170 x 145 x 65 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-10 to +55 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Supply\u003c\/td\u003e\n\u003ctd\u003e24\/48 VDC via backplane\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChannels\u003c\/td\u003e\n\u003ctd\u003e8 isolated thermocouple inputs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInput Range\u003c\/td\u003e\n\u003ctd\u003e+\/-100 mV\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermocouple Types\u003c\/td\u003e\n\u003ctd\u003eJ, K, T, E, N, R, S, B (per-channel configurable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eResolution\u003c\/td\u003e\n\u003ctd\u003e16-bit\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAccuracy\u003c\/td\u003e\n\u003ctd\u003e+\/-0.2 deg C (including CJC and linearization)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTemperature Drift\u003c\/td\u003e\n\u003ctd\u003e+\/-5 ppm\/deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCJC Method\u003c\/td\u003e\n\u003ctd\u003ePer-channel precision sensors (+\/-0.05 deg C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation\u003c\/td\u003e\n\u003ctd\u003e1800 Vrms channel-to-backplane\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCommon Mode Rejection\u003c\/td\u003e\n\u003ctd\u003e115 dB (filtered)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDigital Filtering\u003c\/td\u003e\n\u003ctd\u003eProgrammable (50 Hz, 60 Hz, 250 Hz, 500 Hz cutoff)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInput Impedance\u003c\/td\u003e\n\u003ctd\u003e\u0026gt;10 M ohm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eUpdate Rate\u003c\/td\u003e\n\u003ctd\u003e40 ms (all channels synchronized)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting\u003c\/td\u003e\n\u003ctd\u003eVME rack \/ Mark VI backplane\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication and Signal Isolation\u003c\/h3\u003e\n\u003cp\u003eThe DS200TCCBG3ANE interfaces directly with the Mark V\/VI control core via high-speed backplane bus communication, delivering deterministic sensor telemetry without network latency overhead. To prevent ground loops caused by high-voltage plant potential differences, the card incorporates 1800 Vrms channel-to-backplane galvanic isolation. Channel-density scaling is optimized for dense turbine exhaust configurations, maintaining high signal-to-noise ratios even in extreme electromagnetic environments. Integrated cold junction compensation (CJC) processing hardware converts raw sensor millivolts locally, reducing host processor firmware overhead during real-time turbine trip evaluation cycles.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Can the DS200TCCBG3ANE be hot-swapped during active turbine operation?\u003c\/p\u003e\n\u003cp\u003eA: No, hot-swapping the board while the backplane bus is energized is not permitted. Power off the VME rack or designated panel segment before insertion or removal to prevent backplane bus disturbance or damage to sensitive analog conversion components.\u003c\/p\u003e\n\u003cp\u003eQ: How does channel-to-backplane galvanic isolation impact sensor wiring safety?\u003c\/p\u003e\n\u003cp\u003eA: The 1800 Vrms galvanic isolation barrier prevents high transient voltages on sensor field leads from penetrating the control system backplane, protecting core CPU modules and preventing ground loop currents from degrading 16-bit ADC measurement precision.\u003c\/p\u003e\n\u003cp\u003eQ: What grounding method is required for thermocouple signal shielding?\u003c\/p\u003e\n\u003cp\u003eA: Thermocouple extension cables must have their individual and overall shields grounded at a single point on the designated system ground bar inside the cabinet. Never ground the shield at both the sensor head and the control cabinet, as ground potential differentials introduce measurement errors.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eEnsure the VME rack slot or Mark VI backplane position is fully de-energized prior to seating the module.\u003c\/li\u003e\n\u003cli\u003eVerify card edge connectors for bent pins or debris before sliding the board into the card cage guide rails.\u003c\/li\u003e\n\u003cli\u003eTighten the top and bottom retaining screws on the front panel to ensure solid frame grounding and prevent board dislodgement from vibration.\u003c\/li\u003e\n\u003cli\u003eRoute thermocouple field wiring in separate conduits away from high-voltage AC motor drives and heavy inductive loads to prevent electromagnetic coupling.\u003c\/li\u003e\n\u003cli\u003eTerminate shield conductors to the dedicated panel earth bar using short, direct ground leads. Maintain a minimum thread engagement of 5 full turns on NPT ground lugs.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":44472996266072,"sku":"DS200TCCBG3ANE","price":100.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0670\/2039\/0488\/files\/DS200TCCBG1B_e35f3dfa-45e5-4f1d-9740-57a6a385ee5c.jpg?v=1785234047","url":"https:\/\/www.industriaxplc.com\/ar\/products\/ge-ds200tccbg3ane-mark-v-vi-thermocouple-analog-input-board","provider":"IndustriaX Limited","version":"1.0","type":"link"}